发明名称 Method of fabricating gate dielectric layer and method of fabricating semiconductor device
摘要 A method of fabricating a gate dielectric layer is described. First, a well is produced in a substrate. Later, the substrate is cleaned. Then the substrate is processed by a pre-annealed process. Afterwards, a gate dielectric layer is formed on the substrate. As a result, the on-current of the semiconductor device can be increased.
申请公布号 US7294541(B2) 申请公布日期 2007.11.13
申请号 US20050163470 申请日期 2005.10.20
申请人 UNITED MICROELECTRONICS CORP. 发明人 JENG LI-SHIAN;LEE TUNG-HSING;CHENG TZYY-MING;SHEN TZERMIN;CHO DA-CHING
分类号 H01L21/336;H01L21/8234 主分类号 H01L21/336
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