| 摘要 |
A polishing pad is provided for uniformly planarizing a wafer surface in a short time. The polishing pad (10) is composed of a pad main body (11) having a polishing surface and a lining (12) fixed on a rear surface of the pad main body (11). The elastic modulus of the pad main body (11) is within a range of 600psi-16,000psi, preferably 1,600psi-16,000psi, when a compression pressure of 2psi to 16psi is applied. The thickness of the pad main body (11) is within a range of 0.5mm-3.0mm. The elastic modulus of the lining (12) is within a range lower than the elastic modulus of the pad main body (11) but higher than 300psi, when the above mentioned compression pressure is applied.
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