| 摘要 |
A substrate treating apparatus is provided to minimize a variation in a concentration and a temperature of a liquid which is supplied to dry the substrate. A substrate treating apparatus includes a substrate support member(110), a first nozzle unit, and lower and upper covers(120,130). The substrate support member includes a chuck on which a substrate is placed. The first nozzle unit sprays a drying liquid on the substrate. An upper portion of the lower cover is opened. The lower cover is arranged to surround the chuck. The upper cover opens or closes an upper portion of the lower cover, so that the substrate is separated from the outside during a drying process. The first nozzle unit includes a nozzle which is arranged on the substrate. Plural spray holes are formed in a horizontal line from a center to an edge of the substrate. An aperture size of the spray hole is increased from the center to the edge of the substrate.
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