| 摘要 |
<p>A wafer chuck is provided to prevent a wafer from being damaged by stably chucking the wafer using lower and upper mounts during a high speed transfer process. A wafer chuck includes a frame, a lower mount(211), and an upper mount(212). The lower mount is fixed on the frame and supports a wafer. The lower mount is arranged at a position lower than a center of the wafer. The upper mount is movably assembled to the frame and supports the wafer. The upper mount is arranged at a position higher than the center of the wafer. The upper mount has a cylindrical bar-like shape. An insertion groove is formed on an overall surface of the upper mount. An edge portion of the wafer is inserted into the insertion groove. The frame includes long-hole type slide grooves, to which both ends of the upper mount are inserted.</p> |
