发明名称 |
Method for improving the thermal cycled adhesion of thick-film conductors on dielectric |
摘要 |
An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.
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申请公布号 |
US7294390(B2) |
申请公布日期 |
2007.11.13 |
申请号 |
US20050111317 |
申请日期 |
2005.04.21 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
CARTER BRADLEY H.;FLEDERBACH LYNDA G.;ISENBERG JOHN K. |
分类号 |
B32B3/00;H05K1/00 |
主分类号 |
B32B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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