发明名称 |
Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same |
摘要 |
A circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The substrate includes a first conductive layer with a plurality of conductors on which an electrical component may be positioned and electrically coupled. The pads are coupled to signal lines (e.g., using thru-holes) further within the substrate and these signal lines are further coupled to a second plurality of conductive pads located even further within the substrate. The signal lines are positioned so as to lie between the substrate's first conductive layer and a voltage plane within a third conductive layer below the second conductive layer including the signal lines. A second voltage plane may be used adjacent the first voltage plane of the third conductive layer. Thru-holes may also be used to couple the signal lines coupled to the first conductors to a second plurality of conductors which form part of the third conductive layer. A method of making the substrate, and an electrical assembly and information handling system (e.g., computer) utilizing the substrate are also disclosed.
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申请公布号 |
US7294791(B2) |
申请公布日期 |
2007.11.13 |
申请号 |
US20040953923 |
申请日期 |
2004.09.29 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
DANOSKI CHARLES E.;MEMIS IRVING;ROSSER STEVEN G. |
分类号 |
H01R12/04;H05K1/11 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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