Substrate for mounting a semiconductor

摘要

A substrate ( 1 ) is formed from a non-electrically conducting material and is for mounting a semiconductor chip ( 10 ). The substrate has a semiconductor chip mounting portion ( 6 ). A number of first electrically conducting contact portions ( 5 ) are formed on the surface of the material and associated with the mounting portion ( 6 ). A second electrically conducting contact portion ( 3 ) is formed on the surface of the material, and the second electrically conducting contact portion ( 3 ) is adapted to be coupled to testing equipment. A number of electrically conducting paths ( 4 ) are formed on the surface of the material. The conducting paths ( 4 ) electrically connect the second electrically conducting contact portion ( 3 ) to a minority of the first electrically conducting contact portions ( 5 ).