发明名称 |
Electrical interconnect structures for integrated circuits and methods of manufacturing the same |
摘要 |
Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.
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申请公布号 |
US7294217(B2) |
申请公布日期 |
2007.11.13 |
申请号 |
US20040552429 |
申请日期 |
2004.04.09 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
BEATSON DAVID T.;CLAUBERG HORST;DURY KENNETH K. |
分类号 |
B32B37/00;H01L21/60;H01L21/603;H01L21/607;H01L23/485 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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