发明名称 Electronic component with multilayered rewiring plate and method for producing the same
摘要 The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.
申请公布号 US7294910(B2) 申请公布日期 2007.11.13
申请号 US20050519444 申请日期 2005.08.26
申请人 INFINEON TECHNOLOGIES AG 发明人 THOMAS JOCHEN;WENNEMUTH INGO
分类号 H01L23/552;H01L23/31;H01L23/495;H01L23/498 主分类号 H01L23/552
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