发明名称 |
Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
摘要 |
A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.
|
申请公布号 |
US7293692(B2) |
申请公布日期 |
2007.11.13 |
申请号 |
US20040865474 |
申请日期 |
2004.06.10 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
AKAMATSU HIROSHI;KAWAMURA YUKINORI;KAI HIROSHI;KURAMOTO OSAMU;IWASAKI SHIGERU;ASAI KENJI;HIBINO MINORU |
分类号 |
B23K1/00;B23K31/02;B23K1/008;B23K1/19;B23K3/06;B23K35/22;B23K35/26;B23K101/42;C22C13/00;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|