A CIRCUIT BOARD HAVING HEAT SINK LAYER,申请号KR20050057778-传众专利搜索

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发明名称	A CIRCUIT BOARD HAVING HEAT SINK LAYER
摘要
申请公布号	KR100775449(B1)	申请公布日期	2007.11.12
申请号	KR20050057778	申请日期	2005.06.30
申请人		发明人
分类号	H01L23/34	主分类号	H01L23/34
代理机构		代理人
主权项
地址

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