| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent data from being illegally monitored or analyzed by directly probing wiring or the exposed section of a terminal in an electronic substrate. <P>SOLUTION: This electronic substrate is configured as the substrate of each type of electronic equipment by arranging electronic components on a wiring board having wiring. The electronic components include semiconductor elements such as IC and LSI; and chip components such as resistances, capacitors, and inductors. The wiring board is provided with wiring for electrically connecting the electronic components mounted on the wiring board. In this case, resin coating is carired out to the wiring and the exposed section of the terminals of the electronic components. Thus, this resin coating makes it possible to prevent the exposed section on the substrate from being electrically brought into contact from the outside, and any signal or data from being monitored. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
