RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a resin composition for semiconductor encapsulation, which contains an epoxy resin (A), a compound (B) containing two or more phenolic hydroxyl groups, an inorganic filler (C) and a curing accelerator (D). This resin composition for semiconductor encapsulation is characterized in that the epoxy resin (A) contains an epoxy resin (a1) having a structure represented by the general formula (1) below, and the moisture absorption rate of a cured product of the resin composition is not more than 0.22% by weight when the cured product is subjected to a humidification treatment for 168 hours at 85°C at a relative humidity of 85%. (chemical formula 1) (1)