| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lighting equipment in which temperature rise of an LED chip can be suppressed, and an increase in output of optical output power can be achieved. <P>SOLUTION: A light emitting device 1 has an LED chip 10, a heat transfer plate 21 mounted with an LED chip 10; a wiring board 22 having conductor patterns 23 and 23 for power feeding to the LED chip 10 on one surface side, and formed with a window hole (exposed part) 24 that exposes a mounting surface of the LED chip 10 on the heat transfer plate 21; and a circuit board 200 formed with an opening window 204 through which a part of the light emitting device 1 passes, and arranged apart from an equipment body 100. The device is jointed to the equipment body 100 via an insulation layer 90 that has electric non-conductance, and is intervened between the heat transfer plate 21 and the equipment body 100 to joint them and make thermal binding. The insulation layer 90 contains a filling material made up of filler and is formed by epoxy resin sheet that becomes low-viscosity in heating and has high flow property in the heating. <P>COPYRIGHT: (C)2008,JPO&INPIT |
