| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holder capable of applying processing employing plasma even to an external circumferential region of a substrate as a processing target in dry processing employing a mechanical clamp system. SOLUTION: This substrate holder 1 is disposed in a dry process device, and supports a substrate to be subjected to processing employing plasma. The substrate holder comprises a first member 11 provided with a portion (housing portion) 10 for housing the substrate so that a processing surface 2a of the substrate 2 can be exposed, and a second member 12 provided with an adhesive portion 13 for fixing the first member together with a non-processed surface 2b of the substrate. This substrate holder 1 is arranged on a stage 3 in the processing apparatus, and causes a mechanical clamp 4 to press the first member 11, thereby supporting the substrate fixed integrally with the first member. COPYRIGHT: (C)2008,JPO&INPIT |
