发明名称 HIGH-FREQUENCY MODULE USING METAL-WALL, AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency module and a method of manufacturing the same. SOLUTION: This high-frequency module comprises a base substrate 21 with a grounding portion; a plurality of surface-mount elements 22 mounted on the substrate 21; a metal wall 26 connected to the grounding portion on the substrate 21; a resin molding portion 24 which seals the surface-mount elements 22 and the metal wall 26 so that the upper surface of the metal wall 26 is exposed; and a metallic thin film 25 which is formed on the upper surface of the resin molding portion 24 so as to contact with the upper surface of the metal wall 26. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294965(A) 申请公布日期 2007.11.08
申请号 JP20070111481 申请日期 2007.04.20
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 OH KWANG JAE;SUNG JE HONG;CHOI YOON HYUCK;LEE TAE SOO
分类号 H01L23/29;H01L23/02;H01L23/31;H01L25/04;H01L25/18 主分类号 H01L23/29
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