发明名称 CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a small circuit module having excellent electromagnetic shielding function. SOLUTION: An electronic component 3 has a shielding function and has the upper surface held at a reference potential. The electronic component 3 and a semiconductor component 4 are mounted on the upper surface of a wiring substrate 2. These components are covered with an insulating resin 5, and a conductive layer 6 is formed on the upper surface of the insulating resin 5. The conductive layer 6 is held at the reference potential by connecting the conductive layer 6 with a portion of the electronic component 3, which is held at the reference potential of the electronic component 3 and exposed from the insulating resin 5. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294828(A) 申请公布日期 2007.11.08
申请号 JP20060148930 申请日期 2006.05.29
申请人 KYOCERA CORP 发明人 HATANAKA HIDEFUMI;MATSUO KO
分类号 H01L23/00 主分类号 H01L23/00
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