发明名称 WIRING BOARD, DISPLAY AND THEIR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which can prevent damage on a conductive layer, and to provide its manufacturing method and a display. SOLUTION: The method for manufacturing a wiring board comprises a first etching step of etching a lower layer 31 and an upper layer 32 through a resist pattern 33 such that the lower layer 31 containing Al and the upper layer 32 containing Mo are subjected to side etching, an ashing step of retreating the resist pattern 33 to expose the surface at the side edge portion of the upper layer 32 following to the first etching step, and a second etching step of performing etching through the retreated resist pattern 33 such that the upper layer 32 has a forward tapered cross-section following to the ashing step. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294672(A) 申请公布日期 2007.11.08
申请号 JP20060120714 申请日期 2006.04.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAGAMI KAZUAKI;HINO TERUSHIGE;SHIBATA EIJI;YABIKU HIDEO
分类号 H01L21/3205;G02F1/1343;H01L21/28;H01L21/3213;H01L21/336;H01L23/52;H01L29/786 主分类号 H01L21/3205
代理机构 代理人
主权项
地址