| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of packaging semiconductor devices capable of fixing semiconductor devices on a substrate reliably and improving production efficiency. SOLUTION: The method of packaging the semiconductor device for flip-chip-packaging the semiconductor device having a thickness smaller than the depth of a recess into the recess formed on the substrate includes steps of: tentatively fixing the semiconductor device 20 to the recess 24a; thereafter bring the contact surface of an interposition member 35 into contact with the semiconductor device 20 by using the interposition member 35; and pressing the interposition member 35 by a bonding tool 36 to regularly fix the semiconductor device 20 to the recess 24a, wherein the interposition member 35 has the contact surface that is smaller than the opening area of the recess 24a and is larger than the outer shape of the semiconductor device 20, and has a thickness in which the surface opposite to the contact surface is located superior to the surface of a substrate at a side where the recess 24a is open while the contact surface is in contact with the semiconductor device 20. COPYRIGHT: (C)2008,JPO&INPIT
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