| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method and equipment in which temperature control is performed well by detecting the melting point of solder. SOLUTION: When the temperature of solder rises due to heating and the time of fusion of solder is reached, heat of fusion is absorbed by solder and such a tendency as the solder temperature T detected by a thermocouple falls off as the time elapses is shown, and the differentiated valueΔT of solder temperature shows a negative value. When a decision is made that the differentiated valueΔT of solder temperature became smaller than a heating off threshold th; a controller delivers a heating off control signal to a high frequency power supply, and stops current supply to a coil thus altering the heating condition to turn off heating for solder. Temperature control of soldering can be performed with high precision by detecting the melting point of solder exactly even if a thermocouple is used. COPYRIGHT: (C)2008,JPO&INPIT
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