BROADBAND TRANSITION FROM A VIA INTERCONNECTION TO A PLANAR TRANSMISSION LINE IN A MULTILAYER SUBSTRATE
摘要
According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.
申请公布号
WO2007102597(B1)
申请公布日期
2007.11.08
申请号
WO2007JP54621
申请日期
2007.03.02
申请人
NEC CORPORATION;NEC ELECTRONICS CORPORATION;KUSHTA, TARAS;NARITA, KAORU;KANEKO, TOMOYUKI;OGOU, SHIN-ICHI