| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition for easily fabricating a thick film wiring pattern which is nearly free from pattern defects such as bubbles and loss of shape, and a wiring forming material using the composition. <P>SOLUTION: [1] The radiation-sensitive resin composition contains (A) an alkali-soluble resin which is (a) a novolac resin obtained by condensing a phenol compound and an aldehyde compound, (B) an epoxy group-containing silicon compound and (C) a compound which generates an acid upon irradiation with a radiation, wherein the radiation-sensitive resin composition contains a compound having a boiling point under 1 atm being ≤250°C in an amount of ≤0.5 mass% based on the total amount of the composition. [2] The wiring forming material comprises the radiation-sensitive resin composition. [3] A semiconductor device having a metal wiring pattern obtained using the wiring forming material is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
