SUBSTRATE TREATING METHOD, SEMICONDUCTOR APPARATUS AND SUBSTRATE TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating method by which treating hours in the filling of non-penetrated holes formed on the substrate with a conductive body by a plating method is remarkably decreased to reduce the manufacturing cost of a semiconductor apparatus, the semiconductor apparatus and a substrate treating apparatus. SOLUTION: The substrate treating method is carried out by forming the non-penetrated holes 100 on the substrate W and filling the conductive body (plated film 105) inside the non-penetrated holes 100 by the plating method. A plating solution Q contains solid particles 103. When the electroplating is carried out using the plating solution Q, the solid particles 103 are taken into the plating film 105 simultaneously with the formation of the plating film to increase the volume of the plating film 105. COPYRIGHT: (C)2008,JPO&INPIT