| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating treatment device which enables suitable film deposition treatment. SOLUTION: The plating treatment device (1) comprises: a plating treatment tank (12) of storing a plating liquid in which a substrate (7) is dipped; and a substrate holding part (11) of rotatably holding the substrate (7) into a horizontal plane. Here, the plating treatment tank (12) includes an anode electrode (15) constituted at the inside of the plating treatment tank. Further, the substrate holding part (11) includes a cathode electrode contacted with the substrate (7) and applying voltage thereto. The plating treatment device (1) comprises: a plating liquid circulation flow passage (8) for circulating a plating liquid exhausted from the plating treatment tank (12) via a first exhaust part to the plating treatment tank; a second flow passage (14) for feeding the plating liquid flowing above the anode electrode (15) and exhausted via a second exhaust part to the plating liquid circulation flow passage (8); and a flow rate control valve (6) provided between the plating liquid circulation flow passage (8) and the second flow passage (14) and controlling the flow rate of the plating liquid from the second flow passage (14). COPYRIGHT: (C)2008,JPO&INPIT |
