| 摘要 |
PROBLEM TO BE SOLVED: To provide: a semiconductor sealing resin pellet having excellent solder heat resistance and excellent reliability and preventing the occurrence of stage shift and wire sweep during sealing a semiconductor with the resin; a semiconductor device in which a semiconductor element is sealed using the semiconductor sealing resin pellet; and a method of manufacturing the semiconductor sealing resin pellet. SOLUTION: The semiconductor sealing resin pellet is formed by molding a molten resin, which in turn is a resin composition containing inorganic filler by≥80 wt.% of the whole, and the specific surface area of the pellet is equal to or greater than 4.5×10<SP>-4</SP>m<SP>2</SP>/g. COPYRIGHT: (C)2008,JPO&INPIT
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