| 摘要 |
PROBLEM TO BE SOLVED: To provide a visual inspection method and a visual inspection apparatus that allows for an easy focus correction while dealing with a warpage of a wafer and significant reduction of inspection time when imaging inspection images of each portion of the wafer. SOLUTION: The mark focus point of an alignment pattern used when aligning a wafer (P1) is measured (P2). A warpage shape of the wafer is obtained based on the mark focus point. Each focus position in each portion of each surface of the wafer to be inspected is calculated from the warpage shape (P3). Therefore, it becomes unnecessary to perform focus adjustment (focusing) for each portion of the surface of the wafer to be inspected. In other words, the focus position in each portion of the wafer can be obtained without taking time to focus each portion of the wafer. This allows an easy focus correction while dealing with the warpage of the wafer, which has holes or the back of which was supposed to be difficult to be contacted, and significantly reduces the time required to visually inspect the wafer. COPYRIGHT: (C)2008,JPO&INPIT
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