发明名称 WIRING BOARD AND CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board and a circuit module excellent in reflection characteristics or insertion loss characteristics for high frequency signal by reducing warp or twist of the wiring board effectively. SOLUTION: The wiring board 1 comprises a resin element 2, a wiring pattern 3 for mounting a high frequency electronic component formed on its front major surface A side, and a ground conductor 4 formed on the back major surface B side. The ground conductor 4 on the back major surface B side consists of annular conductors 4A-4E arranged concentrically, and stripe conductors 9A-9D extending radially. The annular conductors 4A-4E are conducted by the stripe conductors 9A-9D and the ground conductor 4 is connected to the ground potential. Out of the annular conductors 4A-4E, the outside annular conductor has a large dimension in the width direction, and the inside annular conductor has a small dimension in the width direction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294675(A) 申请公布日期 2007.11.08
申请号 JP20060120811 申请日期 2006.04.25
申请人 MURATA MFG CO LTD 发明人 HIROSHIMA TAKASHI
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
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