| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents the occurrence of disconnection or short circuiting, and to provide its manufacturing method. SOLUTION: An electrode connection 13 is formed by forming a via hole so that the top of a pad electrode 4 may be surrounded in the rear surface side of a semiconductor substrate 2. In this case, since metal traces which connect the pad electrode 4 and an electric conductive terminal 12 become unnecessary, the disconnection and the like derived from corrosion of metal traces do not arise. Further, since the contact area of the pad electrode 4 and the electrode connection 13 is large, disconnection does not occur. In a manufacturing process, since the rear surface of the pad electrode 4 is not exposed once, neither contamination of foreign substances nor contamination (pollution) arises in the contact of the pad electrode 4 and the electrode connection 13. COPYRIGHT: (C)2008,JPO&INPIT
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