| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional image building method capable of obtaining a three-dimensional image with better image quality than that of a conventional one and reflecting precisely a test piece structure, and a transmission electron microscope. SOLUTION: TEM images I(θ<SB>1</SB>), I(θ<SB>2</SB>), ... I(θ<SB>n</SB>) are obtained at respective test piece inclination anglesθ<SB>1</SB>,θ<SB>2</SB>, ...θ<SB>n</SB>, and the image data of the inclined image series S<SB>1</SB>constructed of the TEM images I(θ<SB>1</SB>), I(θ<SB>2</SB>), ... I(θ<SB>n</SB>) are stored in an image memory 16. This process is repeatedly carried out, and the image data of the inclined image series S<SB>2</SB>, S<SB>3</SB>, ... S<SB>m</SB>constituted of the TEM images I(θ<SB>1</SB>), I(θ<SB>2</SB>), ... I(θ<SB>n</SB>) are stored in the image memory 16. An integration circuit 17 extracts the TEM images of the same test piece inclination angles from the inclined image series S<SB>1</SB>, S<SB>2</SB>, ... S<SB>m</SB>, and integrates these and obtains the integrated image for every test piece inclination anglesθ<SB>1</SB>,θ<SB>2</SB>, ...θ<SB>n</SB>. A three-dimensional image building circuit 18 builds up the 3-dimensional images of the test piece based on the integrated images obtained by the integration circuit 17. COPYRIGHT: (C)2008,JPO&INPIT
|
