| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element array which reduces the occurrence of stray light and leakage light, prevents the cutting of bonding wire at a chip corner, and makes a covering process of a protect film unnecessary. <P>SOLUTION: Resin patterns 52, 64 are formed on a chip surface. An upper surface of a base layer is roughened. A stray light preventing wall 52 is arranged, and side surface thereof is roughened. The light emitted from the light emitter is shaded by the preventing wall, and is scattered by the preventing wall and the roughened surface of the base layer. Consequently, the occurrence of stray light and leakage light can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
