| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable multilayer printed circuit board that can be directly electrically connected to an IC chip without using lead parts. <P>SOLUTION: The corner of the IC chip 20 incorporated in the multilayer printed circuit board is chamfered. Therefor, a stress is not concentrated in the corner of the IC chip when the multilayer printed circuit board is suffered from a heat cycle. The reliability of the multiple printed circuit board is improved, so that delaminations between an inter layer resin insulation layer 50 and a core substrate 30, and the interlayer resin insulation layer 50 and the IC chip near the corner are prevented, also the cracking in the inter layer insulation layer 50 is prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT |
