| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting light emitting device capable of preventing cracks from being generated at junction portions for connecting electrodes for external connection and conductor patterns of a wiring board caused by a difference in a coefficient of thermal expansion between a packaging substrate and the wiring board. <P>SOLUTION: A surface-mounting light emitting device 1 is equipped with: an LED chip 10; and a packaging substrate 20 in which the LED chip 10 is mounted, wherein electrodes 25, 25 for external connection which are formed at both sides in the setting direction in the packaging substrate 20 and are electrically connected to the LED chip 10 are fixed to conductor patterns 83, 83 of a wiring board 80 via junctions 90, 90, and are used. There formed are slits 23, 23 intersecting with a straight line connecting the electrodes 25, 25 for external connection, and thereby the packaging substrate 20 becomes expandable and elastically deformable in the direction along the straight line. <P>COPYRIGHT: (C)2008,JPO&INPIT |
