| 摘要 |
PROBLEM TO BE SOLVED: To constitute a package for an optical element, reduced in the deterioration of optical characteristics upon operation of an optical element and having excellent high-frequency characteristics while being inexpensive. SOLUTION: The package for the optical element in reference to this invention is equipped with: a metal frame 24, having a substrate 26 constituted of a metal plate and a rectangular die pad unit 28, raised by bending the substrate 26 by 90 degrees; a signal lead pin 18 orthogonal to the principal surface of the substrate 26 and extended into the reverse direction of the die pad unit 28 with respect to the substrate 26 while being arranged so as to be apart from the metal frame 24; and a resin mold unit 25, closely contacted with the principal surface of the substrate 26 and provided with a plate type resin substrate 40 along the substrate 26 while the signal lead pin 18 is projected out of the surface of the resin substrate 40 so that the circumference of the signal lead pin 18 is buried and the metal frame 24 as well as the signal lead pin 18 are fixed thereto. COPYRIGHT: (C)2008,JPO&INPIT
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