| 摘要 |
PROBLEM TO BE SOLVED: To seal resin in a state that a portion to be a terminal exposed from mold resin out of a lead frame is more strongly pressed down to a lower mold, in a method for manufacturing a semiconductor device having QFN package structure. SOLUTION: In a metal mold 200, portions for holding a lead frame 10 between them out of an upper mold 210 constitute projections 211 projected to the lower mold 220 side, so that a boundary becomes a top between the portion and a cavity 230. The constitution is used as a metal mold 200 for sealing resin. In the case of holding the other end side of the lead frame 10 between the upper mold 210 and the lower mold 220, a portion adjacent to the portion held between the upper and lower molds 210, 220 out of the lead frame located in the cavity 230 is bent to the lower mold 220 side, and pressed down to the lower mold 220 as compared with the held portion. COPYRIGHT: (C)2008,JPO&INPIT
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