| 摘要 |
PROBLEM TO BE SOLVED: To provide an element loading method for soldering an element to a substrate with high alignment precision by a simple method, even when it is a compact element whose visualizing is difficult without using any special substrate. SOLUTION: The element loading method comprises a placing step of placing solder on the surface of at least one electrode on a substrate, a loading step of loading at least one surface mounting element on the solder, a heating step of heating and melting solder, a detection step of detecting that the element is positioned at a predetermined place on the electrode, and a cooling step of cooling the solder. Any region other than the electrode on the substrate is coated with insulating materials shedding solder, the element is displaced and loaded so as to be partially overlapped with the electrode or solder in the loading step, and it is detected that the element has been moved to a predetermined part on the electrode due to the surface tension of the solder melted in the heating step by the detection step, and heating in the heating step is ended. COPYRIGHT: (C)2008,JPO&INPIT
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