| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component which can reduce the influence due to a temperature difference between heating and cooling, and improve positional accuracy of an insulating layer and a conductor pattern. SOLUTION: The insulating layer and the conductor pattern are laminated by printing, and a circuit element is formed in the laminate. A supporter for laminating the insulating layer and the conductor pattern by printing is formed of a metal having a low thermal expansion coefficient. COPYRIGHT: (C)2008,JPO&INPIT
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