APPARATUS FOR THINNING A SUBSTRATE AND THINNING SYSTEM HAVING THE SAME

摘要

An apparatus for thinning a substrate includes a securing part and an etching bath. The securing part secures a substrate having a protection tape adhered to a front surface of the substrate. The securing part may rotate the substrate. The etching bath receives an etching solution. The substrate is dipped into the etching solution to etch a whole rear surface of the substrate so that the substrate is thinned. Thus, the substrate may be easily thinned without being damaged.