Semiconductor component e.g. RAM, operating method, involves programming efuses of efuse bank provided at semiconductor component after integrating component in electronic module, where programming is controlled by efuse control register

摘要

The method involves integrating a semiconductor component e.g. buffer component, in an electronic module (12a) e.g. memory module. Efuses of an efuse bank (101) provided at the component are programmed after integrating the component in the module. The component is soldered with the module, when integrating the component into the module. The programming of the efuses is controlled using an efuse control register (103), which is provided on the component, where data is written into the register by a serial and/or quasi-serial bus e.g. system management (SM) bus. An independent claim is also included for a semiconductor component, in particular a buffer component with an efuse.