| 摘要 |
A circuit board has a copper foil layer provided on one side thereof, a tin layer provided on a top of the copper foil layer, and a heat radiating sheet provided on the tin layer. When the circuit board is processed in a reflow oven, the tin layer is melted to associate with the copper foil layer and the heat radiating sheet. High amount of heat produced by electronic elements mounted on the circuit board during operation thereof is absorbed by the copper foil layer and then transmitted to the tin layer, which quickly transfers the absorbed heat to the heat radiating sheet that has a large radiating area, so that the heat is more quickly dissipated into air. A heat pipe may be embedded in the tin layer to enhance the radiating efficiency, so that the electronic elements on the circuit board always have a normal operating temperature.
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