CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

Provided is a circuit board whereupon an electronic component can be directly surface-mounted on a conductor wiring without forming a solder resist, with excellent high-speed transmission characteristics, expanded wiring rule of an electrode terminal of an incorporated function element, and capable of being mounted in a step of connecting with an electronic device with excellent workability and reliability. The electronic device and a method for manufacturing the circuit board are also provided. The circuit board is provided with the function element (1) having an electrode terminal (5); a base material which incorporates a function element (1) and has at least one conductor wiring on each of the front and rear surfaces; and a via (6) for connecting the electrode terminal (5) with the conductor wiring (3) formed on the base material. The conductor wiring formed on either the front side or the rear side of the base material has a surface, which is exposed to the external from the base material, at a position on the same flat surface whereupon the conductor wiring is formed on the base material or at a position inside of such position.