| 摘要 |
<p>[PROBLEMS] To provide a method for producing a wiring board in which high density wiring can be achieved and connection of electronic components can be surely carried out by securing a predetermined mounting area and a connection land regardless of deformation of the wiring board. [MEANS FOR SOLVING PROBLEMS] The method for producing a wiring board having a substrate formed of an insulating material, a via hole formed in the substrate, and a via land formed around the opening of the via hole on the surface of the substrate comprises (a) a step of measuring deformation of the substrate in which the via hole is formed, (b) a step of calculating the position where the via land is to be patterned based on the deformation of the substrate measured at the step (a), and (c) a step of patterning the via land while correcting the position based on the value calculated at the step (b).</p> |
