发明名称 POLYAMIDE RESIN COMPOSITION
摘要 <p>Disclosed is a polyamide resin composition which is excellent not only in mechanical characteristics as typified by strength and elastic modulus, but also in toughness, durability, friction/wear resistance and low water absorption. Specifically disclosed is a polyamide resin composition obtained by blending 0.1-4 parts by mass of an aliphatic epoxy compound (B) having three glycidyl groups in one molecule in 100 parts by mass of a polyamide resin (A) wherein silicate layers of a swelling layered silicate are dispersed. The aliphatic epoxy compound (B) may preferably have an epoxy equivalent weight of not more than 180 g/eq, and may preferably contain trimethylolpropene and/or glycerol as the backbone.</p>
申请公布号 WO2007125907(A1) 申请公布日期 2007.11.08
申请号 WO2007JP58831 申请日期 2007.04.24
申请人 UNITIKA LTD.;NEGI, YUKINARI 发明人 NEGI, YUKINARI
分类号 C08L77/00;C08K3/24;C08L63/00 主分类号 C08L77/00
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