摘要 |
<p>A composition for an organic interlayer dielectric is provided to allow patterning with no need for an etching step using a separate photoresist, and to realize improved current conduction characteristics including hysteresis. A composition for an organic interlayer dielectric comprises a water soluble polymer to which a UV curing agent is added, and a water soluble fluorine compound. The water soluble fluorine compound and the UV curing agent-added water soluble polymer are resent in a ratio of 0.1:1-1:1 on the solid content basis. The water soluble fluorine compound is at least one compound selected from fluoroalkane and derivatives thereof, perfluoroalkyl alcohol ethylene oxide and derivatives thereof, perfluoroalkylcarboxylic acid and salts thereof, perfluoroalkylsulfonic acid and salts thereof, perfluoroalkyloxybenzenesulfonic acid and salts thereof, perfluoroalkylbenzenesulfonic acid and salts thereof, perfluoroalkyl amine and salts thereof, perfluoroalkylsulfonamide and salts thereof, ammonium fluoride, monoethanolamine fluoride and tetramethylammonium fluoride.</p> |