摘要 |
The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the disclosure relates to low-density thermosetting sheet molding compounds (SMC) comprising a treated inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, and substantially the absence of calcium carbonate. The termosetting SMC are used to prepare exterior and structcural thermoset articles, e.g., auto parts and panels, etc. that have Class A Surface Quality.
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申请人 |
ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC;TWARDOWSKA-BAXTER, HELENA;SUMNER, MICHAEL J.;FISHER, DENNIS H. |
发明人 |
TWARDOWSKA-BAXTER, HELENA;SUMNER, MICHAEL J.;FISHER, DENNIS H. |