Bump structure and chip connecting method using the same,申请号KR20060022397-传众专利搜索

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发明名称	Bump structure and chip connecting method using the same
摘要
申请公布号	KR100775121(B1)	申请公布日期	2007.11.08
申请号	KR20060022397	申请日期	2006.03.09
申请人		发明人
分类号	H01L23/488	主分类号	H01L23/488
代理机构		代理人
主权项
地址

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