| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for accurately setting the coordinates of wire bonding with high work efficiency. <P>SOLUTION: First, wire bonding design data are converted into coordinate data of a wire bonding device used. Secondly, the wire bonding device corrects specific coordinate data from among the converted coordinate data to conform to a first bond and a second bond between an actual semiconductor chip and a substrate. Thirdly, all the coordinate data are corrected, in matching with correction in the second step. Fourthly, the coordinate data generated at the third step are converted into design data and are compared with the set data on a microcomputer. Fifthly, a rejectable portion is corrected, in correspondence with the determination for rejection at step 4, thus acquiring the coordinate data. Sixthly, setting of the coordinates for the wire bonding device is ended by the determination of acceptance at step 4. <P>COPYRIGHT: (C)2008,JPO&INPIT |
