| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid a decrease in insulation between wires and a deterioration in the characteristics of a semiconductor element or the like due to the effect of heating during cutting, when a curved part is provided in the outer form of a semiconductor device. <P>SOLUTION: An external connecting terminal 8 is provided on the first principal plane 2a of a circuit board 2 and semiconductor elements 13, 14 are mounted on a second principal plane 2b. A first wiring network 9 is provided on the first principal plane 2a of the circuit board 2 except where the external connecting terminal 8 is formed. A second wiring network 11 is provided on the second principal plane 2b of the circuit board 2. The wiring networks 9, 11 are formed further away from a side 4A having a notch part 5 and a constricted part 6 including a curved part than from other sides (3A, 3B, 4B). <P>COPYRIGHT: (C)2008,JPO&INPIT |
