| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus that can suppress thermal effects on an imaging element. <P>SOLUTION: The imaging apparatus includes a printed circuit board 3; a CCD 1 mounted on one face of the printed circuit board 3; and an imaging element drive circuit 2, mounted on the other side of the printed circuit board 3 at a position that does not overlap the CCD 1, with the printed circuit board 3 in-between and driving the CCD 1. Furthermore, the imaging apparatus is provided with a printing pattern 31c which is formed on the printed circuit board 3, which connects the ground/power source pattern 31a of the CCD and the ground/power source pattern 31b of the imaging element drive circuit, and whose wiring width is smaller than the wiring width of the ground/power source pattern 31a of the CCD and the wiring width of the ground/power source pattern 31b of the imaging element drive circuit. <P>COPYRIGHT: (C)2008,JPO&INPIT |
