| 摘要 |
PROBLEM TO BE SOLVED: To provide a stable joining method capable of repairing even when failure in joining occurs, in a film circuit board which is lengthened by joining strip sheet flexible film circuit boards corresponding to a reel-to-reel type manufacturing device in a COF technique, in achieving high accuracy of a circuit pattern accompanying weight reduction and miniaturization of electronics products. SOLUTION: In this method for manufacturing a film circuit board, a plurality of sheet flexible film circuit boards having a circuit pattern are aligned in order for sequentially joining adjacent sheet flexible film circuit boards by using an adhesive layer. The adhesive layer is formed at a side end of downstream-side short edge of the sheet flexible film circuit board existing in upstream in a conveying direction, and on it, a side end of upstream-side short edge of the adjacent sheet flexible film circuit board existing in downstream-side in the conveying direction is overlaid, so as to sandwich the adhesive layer formed at the side end of the downstream-side short edge of the flexible film circuit board existing in upstream, and then heat and pressure are added to joining them. COPYRIGHT: (C)2008,JPO&INPIT
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