发明名称 WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board in which a short circuit between conductor patterns can be prevented through a simple arrangement. SOLUTION: Terminal in each conductor pattern 2 is formed while being branched into a first terminal 2a and a second terminal 2b. On the surface of each first terminal 2a and second terminal 2b, a tin (Sn) plating layer 2c is formed. The tin plating layer 2c has a thickness of 5μm, for example, and contains tin and copper (Cu) at a weight ratio of 97:3 in this order. Each connection pin 21 of a connector 200 touches the tin plating layer 2c on the opposing side faces of the first terminal 2a and the second terminal 2b. The angleθ(acute angle) is preferably in the range of 45°-80°between each side face of the first terminal 2a and the second terminal 2b with which the connection pin 21 comes into contact and the surface of a base insulation layer 1. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294501(A) 申请公布日期 2007.11.08
申请号 JP20060117503 申请日期 2006.04.21
申请人 NITTO DENKO CORP 发明人 YAMAGUCHI KOICHI
分类号 H05K1/11 主分类号 H05K1/11
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